Company Advantages
DXWE Microelectronics' unique advantages in technological innovation, quality control, service level and other aspects
Core Advantages
Technical Team
Core technical team members are from well-known domestic companies. Design teams, R&D teams, production teams, and all processes are led by engineers with more than 10 years of experience. We have 40+ engineers to solve problems for customers and provide reliable guarantees for product quality.
Production Capacity
Since establishment, we have packaged nearly 1 billion products with a qualification rate of over 99.87%. We have strong production capabilities and stable quality control systems to ensure timely and high-quality delivery of customer orders.
Advanced Equipment
Using international first-class equipment to ensure product reliability and stability. We have imported DFN testing machines, laser printing and sorting integrated machines, packaging machines, testing machines, arc height machines, push-pull machines and other equipment to provide hardware guarantee for product quality.
Innovative Service
DXWE Technology will always adhere to the principle of "quality, innovation, and service", continue to forge ahead, and take "innovation and change, stable quality" as the core concept of enterprise development, providing customers with innovative solutions and high-quality service experiences.
Technical Capabilities
Process Capabilities
- Co-molding Process
- Dispensing Process
- DAF Film Process
- Flip Chip
- Chip Stacking Package
Package Dimensions
- IC Card Module: 6 Pin standard specification (Fill), thickness 480~580 μm
- 6 Pin 4FF specification (Fill), thickness 430~510 μm
- 8 Pin standard specification (Fill), thickness 480~580 μm
- 8 Pin standard specification (Dam & Fill), thickness 480~580 μm
- DFN, QFN: Package size 1*1-12*12 full size standard frame, special-shaped frame.
- Package thickness: 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.65mm, 0.75mm, 0.85mm, 1.0mm.
Product Quality Advantages
Automotive Grade Quality
High-reliability product quality, automotive-grade quality control system and certification system.
High Moisture Resistance
MSL1 certification qualified, high moisture resistance performance.
Green Environmental
Lead-free, bromine-free, green environmental materials (BOM) and process flow.
High Qualification Rate
High product qualification rate, packaging qualification rate reaches 99.9%.
Low Packaging Cost
Master Cu Wire Bond technology, low packaging cost.
Localized Supply
Localized supply chain, rapid response to customer needs.
Price Control Advantages
Quality Control
Complete quality management system and comprehensive certification to ensure optimal product yield. Strict quality control processes provide customers with reliable and stable products.
Price Advantage
Efficient management and procurement, personnel cost control, ultimately achieving product price advantages to benefit customers. We are committed to providing customers with the most cost-effective packaging solutions.
Optimized Management
Management system optimization, vertical management, eliminating complex processes, improving personnel efficiency to gain advantages in labor costs. Streamlined and efficient management model ensures optimal production and operation costs.
Cost Advantage
Optimizing management costs, procurement and personnel cost control, consumption ratio control. Through various cost control measures, ensure products have market-competitive prices and create more value for customers.