DFN Package Technology Introduction

DFN packaging is a new type of electronic packaging process that uses advanced dual-sided flat lead-free packaging. The conductive path between internal pins and pads is short, and the self-inductance coefficient and wiring resistance within the package are very low, providing excellent electrical performance. DFN packaging has high flexibility and provides excellent thermal performance through exposed lead frame pads with direct thermal channels for heat dissipation. Typically, the thermal pad is directly soldered to the circuit board, and thermal vias in the PCB help dissipate excess power to the copper ground plane, absorbing excess heat. QFN packaging (Quad Flat No-lead package) offers excellent electrical and thermal performance, small size, light weight, and other advantages.

DFN封装示意图

Product Features

DFN产品特点介绍图

Miniaturized Design

Chip packaging has smaller dimensions with multiple pads at the bottom, significantly reducing PCB space occupation.

Excellent Thermal Performance

Chips can be directly connected to heat sinks to achieve excellent heat dissipation, improving chip operating stability and reliability.

Automation-Friendly Production

Features that facilitate automated production, improving manufacturing efficiency and product consistency.

Process Capability

Parameter Specification
Package Form Stacked Die Package
Process Mode Secure Wire Arc and Chip Interconnection Process
Product Thickness 0.35mm / 0.4mm / 0.45mm / 0.50mm / 0.55mm / 0.75mm / 0.85mm / 1.0mm

Specifications

Package size: 1.0*1.0~5*6mm

Serial No. Model Pin Count Size(mm) Thickness(mm) Pin Pitch Pin Width(b)mm Pin Length(L)mm E-PAD Size LF-PAD Size Frame Thickness(mm) Test Capability Frame Available Default Packaging
1 DFN02L(1.0×0.6×0.5-P0.65) 2L 1.0×0.6 0.5 0.65 0.5 0.25 20×20 0.127 Y Y TAPE
500×500
2 DFN06L(1.6×1.6×0.75-P0.5) 6L 1.6×1.6 0.75 0.5 0.25 0.25 1.0×0.6 48×31 0.203 Y Y TAPE
1220×800
3 DFN06L(2×2×0.75-P0.65) 6L 2×2 0.75 0.65 0.3 0.3 1.6×0.95 67×43 0.203 Y Y TAPE
1700×1092
4 DFN08L(1.4×1.7×0.5-P0.4) 8L 1.4×1.7 0.5 0.4 0.2 0.55 0.152 Y Y TAPE
5 DFN08L(1.6×1.9×0.5-P0.35) 8L 1.6×1.9 0.5 0.35 0.15 0.55 0.127 Y Y TAPE
6 DFN08L(2×2×0.5-P0.5) 8L 2×2 0.5 0.5 0.2 0.3 1.7×0.9 71×45 0.127 Y Y TAPE
1800×1146
7 DFN08L(2×2×0.75-P0.5) 8L 2×2 0.75 0.5 0.25 0.35 1.2×0.7 63×39 0.203 Y Y TAPE
1600×1000
8 DFN08L(2×3×0.75-P0.5) 8L 2×3 0.75 1.27 0.25 0.4 1.5×1.6 67×75 0.203 Y Y TAPE
1700×1900
9 DFN08L(3×3×0.75-P0.65) 8L 3×3 0.75 0.65 0.28 0.36 1.5×2.3 107×83 0.203 Y Y TAPE
2720×2100
10 DFN08L(5×6×0.75-P1.27)C 8L 5×6 0.75 1.27 0.4 0.5 4×3.8 181×177 0.203 Y Y TRAY
4600×4490
11 DFN10L(1.8×2.1×0.5-P0.4) 10L 1.8×2.1 0.5 0.4 0.2 0.55 0.127 Y Y TRAY
12 DFN10L(2.5×1.0×0.5-P0.5) 10L 2.5×1.0 0.5 0.5 0.2 0.4 22×31 0.127 Y Y TAPE
550×80
13 DFN10L(2×2×0.75-P0.4) 10L 2×2 0.75 0.4 0.2 0.3 1.5×0.9 69×41 0.203 Y Y TRAY
1.76×1.05
14 DFN10L(2×2.5×0.75-P0.4) 10L 2×2.5 0.75 0.4 0.2 0.4 1.6×1.1 1800×1340 0.203 TAPE
15 DFN10L(5×6×0.75-P1.0) 10L 5×6 0.75 1 0.4 0.5 1.2/2×4
双基岛
60/103×181 0.203 Y Y TRAY
1735/2605×4600
16 DFN12L(1.4×2.1×0.5-P0.35) 12L 1.4×2.1 0.5 0.35 0.15 0.55 0.127 TAPE
17 DFN12L(2.4×1.5×0.5-P0.4) 12L 2.4×1.5 0.5 0.4 0.2 0.25 1.8×0.5 87×28 0.127 Y Y TAPE
2220×710
18 DFN12L(3.0×1.5×0.5-P0.45) 12L 3.0×1.5 0.5 0.45 0.2 0.2 2.8×0.7 112×32 0.127 Y Y TAPE
2850×810
19 DFN12L(3.0×3.0×0.5-P0.5) 12L 3×3 0.5 0.5 0.2 0.45 2.55×1.6 108×71 0.203 TAPE
2750×1800
20 DFN12L(3×3×0.75-P0.45) 12L 3×3 0.75 0.45 0.2 0.4 2.5×1.55 71×107 0.203 Y Y TAPE
1800×2720
21 DFN14L(1.4×2.5×0.5-P0.35) 14L 1.4×2.5 0.5 0.35 0.15 0.55 0.127 TAPE
22 DFN16L(4×2×0.5-P0.45) 16L 4×2 0.5 0.45 0.25 0.25 1.19×1.0
1.94×1.0
85×47 55×47 0.127 Y Y TAPE
2150×1200 1400×1200

Application Range

Security chips, automotive electronics, medical device electronics, digital video, RF, data acquisition, level converters, frequency converters, general MCU, automotive audio processors, power management chips, etc.

Security Chips

Chip solutions for encryption, authentication and secure storage

Automotive Electronics

Vehicle control systems and automotive electronic equipment

Medical Device Electronics

Electronic components in medical monitoring and diagnostic equipment

Digital Video

Video processing and transmission equipment

RF Applications

Wireless communication and RF signal processing

Power Management Chips

Power control and management solutions