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DXWE Microelectronics diversified integrated circuit packaging products
DXWE Microelectronics provides various advanced integrated circuit packaging solutions to meet the needs of different application scenarios.
BGA Package
Ball Grid Array packaging technology with I/O terminals distributed in array form as circular or cylindrical solder balls
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QFN Package
Quad Flat No-lead package with large exposed pad at the bottom center for heat dissipation
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LGA Package
Land Grid Array package, high-density and high-performance chip packaging solution
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Custom Packaging
Personalized custom packaging solutions according to customers' special requirements, meeting special application scenarios
Contact UsTechnology Comparison
Compare the characteristics and advantages of different packaging technologies to help you choose the most suitable packaging solution.
| Feature | BGA | QFN | DFN | LGA | Smart Card Module |
|---|---|---|---|---|---|
| Pin Layout | Ball Grid Array Layout | Quad Flat No-lead Layout | Dual Flat No-lead Layout | Land Grid Array Layout | Smart Card Standard Layout |
| I/O Density | High Density | Medium Density | Medium Density | High Density | Low Density |
| Package Size | Medium to Large Size | Small to Medium Size | Small Size | Medium Size | Standardized Size |
| Thermal Performance | Good | Excellent (Heat Pad) | Good | Good | Normal |
| Applications | High-performance Processors, Memory | RF, Analog, Digital IC | Low Power Applications, Portable Devices | Processors, Complex Logic IC | Smart Cards, Security Chips |
| Process Features | Ball Bonding Technology, High Reliability | Surface Mount, Cost Effective | Compact Design, Low Cost | Socket Connection, High Reliability | Module Packaging, High Security |
Applications
Consumer Electronics
Packaging requirements for consumer electronics such as smartphones, tablets, and wearable devices
Communication Equipment
High-performance packaging solutions for 5G base stations, routers, switches and other communication equipment
Industrial Control
Industrial-grade packaging applications for industrial automation, robot control, sensors, etc.
Medical Devices
Medical-grade packaging solutions for medical instruments, diagnostic equipment, implantable devices, etc.
Automotive Electronics
Automotive-grade packaging technology for in-vehicle entertainment, ADAS systems, power control, etc.
Internet of Things
IoT device packaging for smart homes, urban IoT, edge computing, etc.
Product Advantages
Quality Assurance
Strict quality control system ensuring every product meets international standards and customer requirements
Excellent Performance
Advanced packaging processes and materials providing superior electrical performance and reliability
Precision Manufacturing
High-precision production equipment and process control ensuring product dimension and performance consistency
Technology Innovation
Continuous R&D investment and technological innovation providing customers with the most advanced packaging solutions
Environmental Materials
Using eco-friendly lead-free materials and green manufacturing processes, complying with RoHS and other environmental requirements
Custom Services
Providing personalized customization services according to customers' special requirements, meeting different application scenarios