LGA封装技术

LGA Package Introduction

LGA stands for Land Grid Array, which is literally translated as grid array packaging. Its main feature is that it uses metal contact packaging to replace the previous pin plugs, and is a packaging technology that can be removed and replaced at any time.

Product Features

Our LGA products can achieve floating chip mounting, double-layer wire arc bonding, cross-wire bonding, and can realize SIP packaging composed of multiple IC chips and different types of components.

LGA工艺示意图

High Density

LGA packaging has high packaging density, suitable for compact packaging applications.

Excellent Electrical Performance

The core board of LGA packaging is soldered close to the bottom board surface, which can significantly shorten the distance between the chip and PCB, improving electrical performance.

Process Capability

Parameter Specification
Package Size 2*2~12*12mm
Package Form Customizable according to customer requirements
Process Features High package density, excellent electrical performance, high reliability, good thermal performance, easy installation

Specifications

Package size: 2*2~12*12mm

Serial No. Package Type Pin Count Package Width/mm Package Length/mm Package Thickness/mm Total Height
1 LGA 6L 2 4 0.4 0.6
2 LGA 8L 1.5 4 0.4 0.6
3 LGA 16L 5 5 1.05 1.31
4 LGA 24L 3.5 6 1.05 1.31
5 LGA 56L 6 9 1.05 1.31

Application Range

Applied in information communication, smart home appliances, medical device electronics, wearable products, industrial control, Internet of Things and other fields.

Processors, logic, memory, applied in wearable, 3C digital, medical device electronics, security chips and other fields.

Information Communication

Network equipment, communication modules, wireless transmission equipment, etc.

Smart Home Appliances

Smart home controllers, smart TVs, smart speakers, etc.

Medical Equipment

Electronic components in medical monitoring and diagnostic equipment

Wearable Products

Smart watches, health monitoring devices, activity trackers

Industrial Control

Industrial automation equipment, process control systems, robot control

Internet of Things

Sensor nodes, smart gateways, edge computing devices