Packaging Technology Service
Advanced packaging technology solutions providing reliable protection and efficient interconnection for chips
Service Introduction
DXWE provides various packaging services to meet customers' chip packaging needs, including e-SIM card module packaging, DFN, QFN, PDFN, MEMS QFN, RFID DFN/QFN, LGA, SIP and other integrated circuit chip packaging forms. With "diverse packaging forms, complete packaging sizes, leading technology, high yield, stable quality, and fast service" to serve customers and the market, serving the development of China's electronics industry. We cooperate with customers in multiple modes from chip design and packaging design aspects to meet customers' requirements for product performance, quality, cycle and cost.
Manufacturing Capabilities
Copper wire, palladium copper, gold wire, alloy wire (0.7mil-1.7mil)
Need Professional Packaging Solutions?
DXWE Microelectronics has industry-leading packaging technology and rich project experience, providing the most suitable packaging solutions for your products. Our technical team is ready to provide professional consultation and support.
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