DFN Package Introduction
Advanced dual-sided flat no-lead packaging process
DFN Package Technology Introduction
DFN packaging is a new type of electronic packaging process that uses advanced dual-sided flat lead-free packaging. The conductive path between internal pins and pads is short, and the self-inductance coefficient and wiring resistance within the package are very low, providing excellent electrical performance. DFN packaging has high flexibility and provides excellent thermal performance through exposed lead frame pads with direct thermal channels for heat dissipation. Typically, the thermal pad is directly soldered to the circuit board, and thermal vias in the PCB help dissipate excess power to the copper ground plane, absorbing excess heat. QFN packaging (Quad Flat No-lead package) offers excellent electrical and thermal performance, small size, light weight, and other advantages.
Product Features
DFN packaging combines miniaturization and flexibility. Multiple pads at the bottom significantly reduce PCB space occupation, and chips can be directly connected to heat sinks for excellent thermal dissipation, improving operating stability and reliability while remaining friendly to automated production.
Miniaturized Design
Chip packaging has smaller dimensions with multiple pads at the bottom, significantly reducing PCB space occupation.
Excellent Thermal Performance
Chips can be directly connected to heat sinks to achieve excellent heat dissipation, improving chip operating stability and reliability.
Automation-Friendly Production
Features that facilitate automated production, improving manufacturing efficiency and product consistency.
Process Capability
| Parameter | Specification |
|---|---|
| Package Form | Stacked Die Package |
| Process Mode | Secure Wire Arc and Chip Interconnection Process |
| Product Thickness | 0.35mm / 0.4mm / 0.45mm / 0.50mm / 0.55mm / 0.75mm / 0.85mm / 1.0mm |
Specifications
Package size: 1.0*1.0~5*6mm
| Serial No. | Model | Pin Count | Size(mm) | Thickness(mm) | Pin Pitch | Pin Width(b)mm | Pin Length(L)mm | E-PAD Size | LF-PAD Size | Frame Thickness(mm) | Test Capability | Frame Available | Default Packaging |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1 | DFN02L(1.0×0.6×0.5-P0.65) | 2L | 1.0×0.6 | 0.5 | 0.65 | 0.5 | 0.25 | 无 | 20×20 | 0.127 | Y | Y | TAPE 500×500 |
| 2 | DFN06L(1.6×1.6×0.75-P0.5) | 6L | 1.6×1.6 | 0.75 | 0.5 | 0.25 | 0.25 | 1.0×0.6 | 48×31 | 0.203 | Y | Y | TAPE 1220×800 |
| 3 | DFN06L(2×2×0.75-P0.65) | 6L | 2×2 | 0.75 | 0.65 | 0.3 | 0.3 | 1.6×0.95 | 67×43 | 0.203 | Y | Y | TAPE 1700×1092 |
| 4 | DFN08L(1.4×1.7×0.5-P0.4) | 8L | 1.4×1.7 | 0.5 | 0.4 | 0.2 | 0.55 | 无 | 无 | 0.152 | Y | Y | TAPE |
| 5 | DFN08L(1.6×1.9×0.5-P0.35) | 8L | 1.6×1.9 | 0.5 | 0.35 | 0.15 | 0.55 | 无 | 无 | 0.127 | Y | Y | TAPE |
| 6 | DFN08L(2×2×0.5-P0.5) | 8L | 2×2 | 0.5 | 0.5 | 0.2 | 0.3 | 1.7×0.9 | 71×45 | 0.127 | Y | Y | TAPE 1800×1146 |
| 7 | DFN08L(2×2×0.75-P0.5) | 8L | 2×2 | 0.75 | 0.5 | 0.25 | 0.35 | 1.2×0.7 | 63×39 | 0.203 | Y | Y | TAPE 1600×1000 |
| 8 | DFN08L(2×3×0.75-P0.5) | 8L | 2×3 | 0.75 | 1.27 | 0.25 | 0.4 | 1.5×1.6 | 67×75 | 0.203 | Y | Y | TAPE 1700×1900 |
| 9 | DFN08L(3×3×0.75-P0.65) | 8L | 3×3 | 0.75 | 0.65 | 0.28 | 0.36 | 1.5×2.3 | 107×83 | 0.203 | Y | Y | TAPE 2720×2100 |
| 10 | DFN08L(5×6×0.75-P1.27)C | 8L | 5×6 | 0.75 | 1.27 | 0.4 | 0.5 | 4×3.8 | 181×177 | 0.203 | Y | Y | TRAY 4600×4490 |
| 11 | DFN10L(1.8×2.1×0.5-P0.4) | 10L | 1.8×2.1 | 0.5 | 0.4 | 0.2 | 0.55 | 无 | 无 | 0.127 | Y | Y | TRAY |
| 12 | DFN10L(2.5×1.0×0.5-P0.5) | 10L | 2.5×1.0 | 0.5 | 0.5 | 0.2 | 0.4 | 无 | 22×31 | 0.127 | Y | Y | TAPE 550×80 |
| 13 | DFN10L(2×2×0.75-P0.4) | 10L | 2×2 | 0.75 | 0.4 | 0.2 | 0.3 | 1.5×0.9 | 69×41 | 0.203 | Y | Y | TRAY 1.76×1.05 |
| 14 | DFN10L(2×2.5×0.75-P0.4) | 10L | 2×2.5 | 0.75 | 0.4 | 0.2 | 0.4 | 1.6×1.1 | 1800×1340 | 0.203 | TAPE | ||
| 15 | DFN10L(5×6×0.75-P1.0) | 10L | 5×6 | 0.75 | 1 | 0.4 | 0.5 | 1.2/2×4 双基岛 | 60/103×181 | 0.203 | Y | Y | TRAY 1735/2605×4600 |
| 16 | DFN12L(1.4×2.1×0.5-P0.35) | 12L | 1.4×2.1 | 0.5 | 0.35 | 0.15 | 0.55 | 无 | 无 | 0.127 | TAPE | ||
| 17 | DFN12L(2.4×1.5×0.5-P0.4) | 12L | 2.4×1.5 | 0.5 | 0.4 | 0.2 | 0.25 | 1.8×0.5 | 87×28 | 0.127 | Y | Y | TAPE 2220×710 |
| 18 | DFN12L(3.0×1.5×0.5-P0.45) | 12L | 3.0×1.5 | 0.5 | 0.45 | 0.2 | 0.2 | 2.8×0.7 | 112×32 | 0.127 | Y | Y | TAPE 2850×810 |
| 19 | DFN12L(3.0×3.0×0.5-P0.5) | 12L | 3×3 | 0.5 | 0.5 | 0.2 | 0.45 | 2.55×1.6 | 108×71 | 0.203 | TAPE 2750×1800 | ||
| 20 | DFN12L(3×3×0.75-P0.45) | 12L | 3×3 | 0.75 | 0.45 | 0.2 | 0.4 | 2.5×1.55 | 71×107 | 0.203 | Y | Y | TAPE 1800×2720 |
| 21 | DFN14L(1.4×2.5×0.5-P0.35) | 14L | 1.4×2.5 | 0.5 | 0.35 | 0.15 | 0.55 | 无 | 无 | 0.127 | TAPE | ||
| 22 | DFN16L(4×2×0.5-P0.45) | 16L | 4×2 | 0.5 | 0.45 | 0.25 | 0.25 | 1.19×1.0 1.94×1.0 | 85×47 55×47 | 0.127 | Y | Y | TAPE 2150×1200 1400×1200 |
Application Range
Security chips, automotive electronics, medical device electronics, digital video, RF, data acquisition, level converters, frequency converters, general MCU, automotive audio processors, power management chips, etc.
Security Chips
Chip solutions for encryption, authentication and secure storage
Automotive Electronics
Vehicle control systems and automotive electronic equipment
Medical Device Electronics
Electronic components in medical monitoring and diagnostic equipment
Digital Video
Video processing and transmission equipment
RF Applications
Wireless communication and RF signal processing
Power Management Chips
Power control and management solutions