One-stop Service
Providing comprehensive one-stop services from chip design verification, packaging, testing to module product manufacturing, covering 5G IoT, medical, communications and other fields.
Packaging Technology Service
Focusing on advanced packaging technologies such as QFN/DFN, BGA/LGA, MEMS, SiP, FC, WLCSP, providing diversified packaging options and customization services.
Testing Technology Service
With comprehensive testing capabilities including CP testing, FT testing, SLT testing, covering analog, digital, mixed-signal, RF and other chip types.
Reliability Testing & Failure Analysis
Providing reliability testing services compliant with JEDEC, AEC-Q and other standards, as well as professional failure analysis (FA) services to ensure product quality.
